System, method, and apparatus for a high-efficiency heat riser

ABSTRACT

A system, method, and apparatus for a heat riser having stackable blocks of thermally conductive material that include an upper block and a lower block, wherein the lower block has a lower surface that is configured to be engaged in thermal communication with a heat source. The lower block also having an inclined upper surface, that is configured to be in thermal communication with a block directly above, having a complemental inclined surface, wherein the blocks are elastically coupled with elastic components. The upper block may slide along the lower block allowing for vertical and horizontal axial elastic adjustment while providing consistent pressure to both the heat source and a cooling source to provide for heat dispersion along a thermal pathway from the heating source through the lower block, upper block and to a cooling source.

CROSS-REFERENCE TO RELATED APPLICATIONS

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RELATED CO-PENDING U.S. PATENT APPLICATIONS

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INCORPORATION BY REFERENCE OF SEQUENCE LISTING PROVIDED AS ATEXT FILE

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FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

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REFERENCE TO SEQUENCE LISTING, A TABLE, OR A COMPUTER LISTING APPENDIX

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COPYRIGHT NOTICE

A portion of the disclosure of this patent document contains materialthat is subject to copyright protection by the author thereof. Thecopyright owner has no objection to the facsimile reproduction by anyoneof the patent document or patent disclosure for the purposes ofreferencing as patent prior art, as it appears in the Patent andTrademark Office, patent file or records, but otherwise reserves allcopyright rights whatsoever.

BACKGROUND OF THE RELEVANT PRIOR ART

One or more embodiments of the invention generally relate to anapparatus for electronics cooling. More particularly, certainembodiments of the invention relate to a heat riser assembly for thecooling of electronics.

The following background information may present examples of specificaspects of the prior art (e.g., without limitation, approaches, facts,or common wisdom) that, while expected to be helpful to further educatethe reader as to additional aspects of the prior art, is not to beconstrued as limiting the present invention, or any embodiments thereof,to anything stated or implied therein or inferred thereupon.

In order for computer components to attain faster speeds, typicallyhigher power consumption may be required. Computer components thatconsume high amounts of power generate a large amount of heat that, whenimproperly handled, may cause damage to the computer component and anysurrounding components. Especially in large scale operations, such as,but not limited to, server farms, datacenters, computing clusters, etc.,efficient and effective cooling of computer components may drasticallyeffect processing power, speed, as well longevity of the overall system.

The following is an example of a specific aspect in the prior art that,while expected to be helpful to further educate the reader as toadditional aspects of the prior art, is not to be construed as limitingthe present invention, or any embodiments thereof, to anything stated orimplied therein or inferred thereupon. By way of educational background,another aspect of the prior art generally useful to be aware of is thatexisting cooling solutions for various computer components typicallycomprise air or water cooling devices. Conventional air coolingsolutions transfer heat through a base plate mounted onto the computercomponent into a heat sink and use specialized fans to dissipate theheat. While air cooling may be an affordable option, the size of theheat sink required for adequate heat dissipation may be an issue formany computing systems, and air cooling may be less efficient than othercooling solutions. Liquid cooling may also be used to dissipate heatfrom computer components, and may be more efficient than air cooling.Because liquid is used, a large heat sink may not be required and theoverall system may be substantially quieter without the loud fansassociated with an air cooling solution. However, liquid cooling mayinclude a risk of leaking and causing damage to the internal componentsof a computer system.

Additionally, with any cooling solution, integration with existing orlegacy devices may be an important factor to consider. With large scaleoperations especially, upgrading a cooling system may requirerefactoring of an entire system to accommodate for more advanced coolingsolutions. While one cooling solution may work with one system, it maynot be easily compatible with another system. Space efficiency in, forexample, without limitation, server farms, may be important for theoverall cost effectiveness and reliability of the system as a whole, soa compact, easily adaptable, and efficient cooling system may bedesirable.

In view of the foregoing, it is clear that these traditional techniquesare not perfect and leave room for more optimal approaches.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is illustrated by way of example, and not by wayof limitation, in the figures of the accompanying drawings and in whichlike reference numerals refer to similar elements and in which:

FIGS. 1A-2C illustrate an exemplary heat riser apparatus, wherein FIG.1A shows a perspective view of a heat riser apparatus, FIG. 1B shows afirst side view of a heat riser apparatus, and FIG. 1C shows a secondcross-section of a heat riser apparatus, in accordance with anembodiment of the present invention;

FIGS. 2A-2C illustrate exemplary vapor chambers of a heat riserapparatus, wherein FIG. 2A shows a cross-sectional view of a heat riserapparatus in a default position, FIG. 2B shows a cross-sectional view ofa heat riser apparatus in a sliding up position, and FIG. 2C shows avapor chamber, in accordance with an embodiment of the presentinvention;

FIGS. 3A-3B illustrate an exemplary heat riser apparatus mounted withina server, wherein FIG. 3A shows a perspective view of a heat riserapparatus mounted within a server, and FIG. 3B shows a cross section ofa heat riser apparatus mounted within a server, in accordance with anembodiment of the present invention;

FIG. 4 illustrates as schematic diagram of an exemplary heat riserapparatus, in accordance with an embodiment of the present invention;

FIG. 5 illustrates an exemplary heat riser mounting, in accordance withan embodiment of the present invention;

FIGS. 6A-6C illustrate an exemplary modified server cover, wherein FIG.6A shows a conventional 2U server, FIG. 6B shows a server with a mountedmodified server cover, and FIG. 6C shows a bottom view of a modifiedserver cover, in accordance with an embodiment of the present invention;

FIGS. 7A-7B illustrate exemplary server measurements, wherein FIG. 7Ashows the height of an exemplary server, and FIG. 7B shows a side viewof an exemplary server, in accordance with an embodiment of the presentinvention;

FIGS. 8A-8C illustrates a stress diagram of an exemplary heat riserapparatus, wherein FIG. 8A shows a heat riser apparatus with totaldeformation, FIG. 8B shows a heat riser apparatus with straindistribution on all components, and FIG. 8C shows a heat riser apparatuswith an even distribution of stress on elastic components, in accordancewith an embodiment of the present invention;

FIGS. 9A-9C illustrates thermal simulation of an exemplary heat riserapparatus, wherein FIG. 9A shows a physical model of a heat riserapparatus, FIG. 9B shows a temperature field of a heat riser apparatus,and FIG. 9C shows a bottom view of a temperature field of a heat riserapparatus, in accordance with an embodiment of the present invention;

FIGS. 10A-10C illustrate an exemplary simplified heat riser, whereinFIG. 10A shows a prospective view of a simplified heat riser, FIG. 10Bshows a cross section of a simplified heat riser, and FIG. 10C shows across section of a simplified heat riser at sliding-up conditions, inaccordance with an embodiment of the present invention; and

FIGS. 11A-11C illustrate an exemplary triple block heat riser, whereinFIG. 11A shows a prospective view of a triple block heat riser, FIG. 11Bshows an exploded view of a triple block heat riser, and FIG. 11C showsa cross-sectional view of a triple block heat riser, in accordance withan embodiment of the present invention.

Unless otherwise indicated illustrations in the figures are notnecessarily drawn to scale.

DETAILED DESCRIPTION OF SOME EMBODIMENTS

The present invention is best understood by reference to the detailedfigures and description set forth herein.

Embodiments of the invention are discussed below with reference to theFigures. However, those skilled in the art will readily appreciate thatthe detailed description given herein with respect to these figures isfor explanatory purposes as the invention extends beyond these limitedembodiments. For example, it should be appreciated that those skilled inthe art will, in light of the teachings of the present invention,recognize a multiplicity of alternate and suitable approaches, dependingupon the needs of the particular application, to implement thefunctionality of any given detail described herein, beyond theparticular implementation choices in the following embodiments describedand shown. That is, there are modifications and variations of theinvention that are too numerous to be listed but that all fit within thescope of the invention. Also, singular words should be read as pluraland vice versa and masculine as feminine and vice versa, whereappropriate, and alternative embodiments do not necessarily imply thatthe two are mutually exclusive.

It is to be further understood that the present invention is not limitedto the particular methodology, compounds, materials, manufacturingtechniques, uses, and applications, described herein, as these may vary.It is also to be understood that the terminology used herein is used forthe purpose of describing particular embodiments only, and is notintended to limit the scope of the present invention. It must be notedthat as used herein and in the appended claims, the singular forms “a,”“an,” and “the” include the plural reference unless the context clearlydictates otherwise. Thus, for example, a reference to “an element” is areference to one or more elements and includes equivalents thereof knownto those skilled in the art. Similarly, for another example, a referenceto “a step” or “a means” is a reference to one or more steps or meansand may include sub-steps and subservient means. All conjunctions usedare to be understood in the most inclusive sense possible. Thus, theword “or” should be understood as having the definition of a logical“or” rather than that of a logical “exclusive or” unless the contextclearly necessitates otherwise. Structures described herein are to beunderstood also to refer to functional equivalents of such structures.Language that may be construed to express approximation should be sounderstood unless the context clearly dictates otherwise.

All words of approximation as used in the present disclosure and claimsshould be construed to mean “approximate,” rather than “perfect,” andmay accordingly be employed as a meaningful modifier to any other word,specified parameter, quantity, quality, or concept. Words ofapproximation, include, yet are not limited to terms such as“substantial”, “nearly”, “almost”, “about”, “generally”, “largely”,“essentially”, “closely approximate”, etc.

As will be established in some detail below, it is well settled law, asearly as 1939, that words of approximation are not indefinite in theclaims even when such limits are not defined or specified in thespecification.

For example, see Ex parte Mallory, 52 USPQ 297, 297 (Pat. Off. Bd. App.1941) where the court said “The examiner has held that most of theclaims are inaccurate because apparently the laminar film will not beentirely eliminated. The claims specify that the film is “substantially”eliminated and for the intended purpose, it is believed that the slightportion of the film which may remain is negligible. We are of the view,therefore, that the claims may be regarded as sufficiently accurate.”

Note that claims need only “reasonably apprise those skilled in the art”as to their scope to satisfy the definiteness requirement. See EnergyAbsorption Sys., Inc. v. Roadway Safety Servs., Inc., Civ. App. 96-1264,slip op. at 10 (Fed. Cir. Jul. 3, 1997) (unpublished) Hybridtech v.Monoclonal Antibodies, Inc., 802 F.2d 1367, 1385, 231 USPQ 81, 94 (Fed.Cir. 1986), cert. denied, 480 U.S. 947 (1987). In addition, the use ofmodifiers in the claim, like “generally” and “substantial,” does not byitself render the claims indefinite. See Seattle Box Co. v. IndustrialCrating & Packing, Inc., 731 F.2d 818, 828-29, 221 USPQ 568, 575-76(Fed. Cir. 1984).

Moreover, the ordinary and customary meaning of terms like“substantially” includes “reasonably close to: nearly, almost, about”,connoting a term of approximation. See In re Frye, Appeal No.2009-006013, 94 USPQ2d 1072, 1077, 2010 WL 889747 (B.P.A.I. 2010)Depending on its usage, the word “substantially” can denote eitherlanguage of approximation or language of magnitude. Deering PrecisionInstruments, L.L.C. v. Vector Distribution Sys., Inc., 347 F.3d 1314,1323 (Fed. Cir. 2003) (recognizing the “dual ordinary meaning of th[e]term [“substantially”] as connoting a term of approximation or a term ofmagnitude”). Here, when referring to the “substantially halfway”limitation, the Specification uses the word “approximately” as asubstitute for the word “substantially” (Fact 4). (Fact 4). The ordinarymeaning of “substantially halfway” is thus reasonably close to or nearlyat the midpoint between the forwardmost point of the upper or outsoleand the rearwardmost point of the upper or outsole.

Similarly, the term ‘substantially’ is well recognized in case law tohave the dual ordinary meaning of connoting a term of approximation or aterm of magnitude. See Dana Corp. v. American Axle & Manufacturing,Inc., Civ. App. 04-1116, 2004 U.S. App. LEXIS 18265, *13-14 (Fed. Cir.Aug. 27, 2004) (unpublished). The term “substantially” is commonly usedby claim drafters to indicate approximation. See Cordis Corp. v.Medtronic AVE Inc., 339 F.3d 1352, 1360 (Fed. Cir. 2003) (“The patentsdo not set out any numerical standard by which to determine whether thethickness of the wall surface is ‘substantially uniform.’ The term‘substantially,’ as used in this context, denotes approximation. Thus,the walls must be of largely or approximately uniform thickness.”); seealso Deering Precision Instruments, LLC v. Vector Distribution Sys.,Inc., 347 F.3d 1314, 1322 (Fed. Cir. 2003); Epcon Gas Sys., Inc. v.Bauer Compressors, Inc., 279 F.3d 1022, 1031 (Fed. Cir. 2002). We findthat the term “substantially” was used in just such a manner in theclaims of the patents-in-suit: “substantially uniform wall thickness”denotes a wall thickness with approximate uniformity.

It should also be noted that such words of approximation as contemplatedin the foregoing clearly limits the scope of claims such as saying‘generally parallel’ such that the adverb ‘generally’ does not broadenthe meaning of parallel. Accordingly, it is well settled that such wordsof approximation as contemplated in the foregoing (e.g., like the phrase‘generally parallel’) envisions some amount of deviation from perfection(e.g., not exactly parallel), and that such words of approximation ascontemplated in the foregoing are descriptive terms commonly used inpatent claims to avoid a strict numerical boundary to the specifiedparameter. To the extent that the plain language of the claims relyingon such words of approximation as contemplated in the foregoing areclear and uncontradicted by anything in the written description hereinor the figures thereof, it is improper to rely upon the present writtendescription, the figures, or the prosecution history to add limitationsto any of the claim of the present invention with respect to such wordsof approximation as contemplated in the foregoing. That is, under suchcircumstances, relying on the written description and prosecutionhistory to reject the ordinary and customary meanings of the wordsthemselves is impermissible. See, for example, Liquid Dynamics Corp. v.Vaughan Co., 355 F.3d 1361, 69 USPQ2d 1595, 1600-01 (Fed. Cir. 2004).The plain language of phrase 2 requires a “substantial helical flow.”The term “substantial” is a meaningful modifier implying “approximate,”rather than “perfect.” In Cordis Corp. v. Medtronic AVE, Inc., 339 F.3d1352, 1361 (Fed. Cir. 2003), the district court imposed a precisenumeric constraint on the term “substantially uniform thickness.” Wenoted that the proper interpretation of this term was “of largely orapproximately uniform thickness” unless something in the prosecutionhistory imposed the “clear and unmistakable disclaimer” needed fornarrowing beyond this simple-language interpretation. Id. In Anchor WallSystems v. Rockwood Retaining Walls, Inc., 340 F.3d 1298, 1311 (Fed.Cir. 2003)” Id. at 1311. Similarly, the plain language of Claim 1requires neither a perfectly helical flow nor a flow that returnsprecisely to the center after one rotation (a limitation that arisesonly as a logical consequence of requiring a perfectly helical flow).

The reader should appreciate that case law generally recognizes a dualordinary meaning of such words of approximation, as contemplated in theforegoing, as connoting a term of approximation or a term of magnitude;e.g., see Deering Precision Instruments, L.L.C. v. Vector Distrib. Sys.,Inc., 347 F.3d 1314, 68 USPQ2d 1716, 1721 (Fed. Cir. 2003), cert.denied, 124 S. Ct. 1426 (2004) where the court was asked to construe themeaning of the term “substantially” in a patent claim. Also see Epcon,279 F.3d at 1031 (“The phrase ‘substantially constant’ denotes languageof approximation, while the phrase ‘substantially below’ signifieslanguage of magnitude, i.e., not insubstantial.”). Also, see, e.g.,Epcon Gas Sys., Inc. v. Bauer Compressors, Inc., 279 F.3d 1022 (Fed.Cir. 2002) (construing the terms “substantially constant” and“substantially below”); Zodiac Pool Care, Inc. v. Hoffinger Indus.,Inc., 206 F.3d 1408 (Fed. Cir. 2000) (construing the term “substantiallyinward”); York Prods., Inc. v. Cent. Tractor Farm & Family Ctr., 99 F.3d1568 (Fed. Cir. 1996) (construing the term “substantially the entireheight thereof”); Tex. Instruments Inc. v. Cypress Semiconductor Corp.,90 F.3d 1558 (Fed. Cir. 1996) (construing the term “substantially in thecommon plane”). In conducting their analysis, the court instructed tobegin with the ordinary meaning of the claim terms to one of ordinaryskill in the art. Prima Tek, 318 F.3d at 1148. Reference to dictionariesand our cases indicates that the term “substantially” has numerousordinary meanings. As the district court stated, “substantially” canmean “significantly” or “considerably.” The term “substantially” canalso mean “largely” or “essentially.” Webster's New 20th CenturyDictionary 1817 (1983).

Words of approximation, as contemplated in the foregoing, may also beused in phrases establishing approximate ranges or limits, where the endpoints are inclusive and approximate, not perfect; e.g., see AK SteelCorp. v. Sollac, 344 F.3d 1234, 68 USPQ2d 1280, 1285 (Fed. Cir. 2003)where it where the court said [W]e conclude that the ordinary meaning ofthe phrase “up to about 10%” includes the “about 10%” endpoint. Aspointed out by AK Steel, when an object of the preposition “up to” isnonnumeric, the most natural meaning is to exclude the object (e.g.,painting the wall up to the door). On the other hand, as pointed out bySollac, when the object is a numerical limit, the normal meaning is toinclude that upper numerical limit (e.g., counting up to ten, seatingcapacity for up to seven passengers). Because we have here a numericallimit—“about 10%”—the ordinary meaning is that that endpoint isincluded.

In the present specification and claims, a goal of employment of suchwords of approximation, as contemplated in the foregoing, is to avoid astrict numerical boundary to the modified specified parameter, assanctioned by Pall Corp. v. Micron Separations, Inc., 66 F.3d 1211,1217, 36 USPQ2d 1225, 1229 (Fed. Cir. 1995) where it states “It is wellestablished that when the term “substantially” serves reasonably todescribe the subject matter so that its scope would be understood bypersons in the field of the invention, and to distinguish the claimedsubject matter from the prior art, it is not indefinite.” Likewise seeVerve LLC v. Crane Cams Inc., 311 F.3d 1116, 65 USPQ2d 1051, 1054 (Fed.Cir. 2002). Expressions such as “substantially” are used in patentdocuments when warranted by the nature of the invention, in order toaccommodate the minor variations that may be appropriate to secure theinvention. Such usage may well satisfy the charge to “particularly pointout and distinctly claim” the invention, 35 U.S.C. § 112, and indeed maybe necessary in order to provide the inventor with the benefit of hisinvention. In Andrew Corp. v. Gabriel Elecs. Inc., 847 F.2d 819, 821-22,6 USPQ2d 2010, 2013 (Fed. Cir. 1988) the court explained that usagessuch as “substantially equal” and “closely approximate” may serve todescribe the invention with precision appropriate to the technology andwithout intruding on the prior art. The court again explained in EcolabInc. v. Envirochem, Inc., 264 F.3d 1358, 1367, 60 USPQ2d 1173, 1179(Fed. Cir. 2001) that “like the term ‘about,’ the term ‘substantially’is a descriptive term commonly used in patent claims to ‘avoid a strictnumerical boundary to the specified parameter, see Ecolab Inc. v.Envirochem Inc., 264 F.3d 1358, 60 USPQ2d 1173, 1179 (Fed. Cir. 2001)where the court found that the use of the term “substantially” to modifythe term “uniform” does not render this phrase so unclear such thatthere is no means by which to ascertain the claim scope.

Similarly, other courts have noted that like the term “about,” the term“substantially” is a descriptive term commonly used in patent claims to“avoid a strict numerical boundary to the specified parameter.”; e.g.,see Pall Corp. v. Micron Seps., 66 F.3d 1211, 1217, 36 USPQ2d 1225, 1229(Fed. Cir. 1995); see, e.g., Andrew Corp. v. Gabriel Elecs. Inc., 847F.2d 819, 821-22, 6 USPQ2d 2010, 2013 (Fed. Cir. 1988) (noting thatterms such as “approach each other,” “close to,” “substantially equal,”and “closely approximate” are ubiquitously used in patent claims andthat such usages, when serving reasonably to describe the claimedsubject matter to those of skill in the field of the invention, and todistinguish the claimed subject matter from the prior art, have beenaccepted in patent examination and upheld by the courts). In this case,“substantially” avoids the strict 100% nonuniformity boundary.

Indeed, the foregoing sanctioning of such words of approximation, ascontemplated in the foregoing, has been established as early as 1939,see Ex parte Mallory, 52 USPQ 297, 297 (Pat. Off. Bd. App. 1941) where,for example, the court said “the claims specify that the film is“substantially” eliminated and for the intended purpose, it is believedthat the slight portion of the film which may remain is negligible. Weare of the view, therefore, that the claims may be regarded assufficiently accurate.” Similarly, In re Hutchison, 104 F.2d 829, 42USPQ 90, 93 (C.C.P.A. 1939) the court said “It is realized that“substantial distance” is a relative and somewhat indefinite term, orphrase, but terms and phrases of this character are not uncommon inpatents in cases where, according to the art involved, the meaning canbe determined with reasonable clearness.”

Hence, for at least the forgoing reason, Applicants submit that it isimproper for any examiner to hold as indefinite any claims of thepresent patent that employ any words of approximation.

Unless defined otherwise, all technical and scientific terms used hereinhave the same meanings as commonly understood by one of ordinary skillin the art to which this invention belongs. Preferred methods,techniques, devices, and materials are described, although any methods,techniques, devices, or materials similar or equivalent to thosedescribed herein may be used in the practice or testing of the presentinvention. Structures described herein are to be understood also torefer to functional equivalents of such structures. The presentinvention will be described in detail below with reference toembodiments thereof as illustrated in the accompanying drawings.

References to a “device,” an “apparatus,” a “system,” etc., in thepreamble of a claim should be construed broadly to mean “any structuremeeting the claim terms” exempt for any specific structure(s)/type(s)that has/(have) been explicitly disavowed or excluded oradmitted/implied as prior art in the present specification or incapableof enabling an object/aspect/goal of the invention. Furthermore, wherethe present specification discloses an object, aspect, function, goal,result, or advantage of the invention that a specific prior artstructure and/or method step is similarly capable of performing yet in avery different way, the present invention disclosure is intended to andshall also implicitly include and cover additional correspondingalternative embodiments that are otherwise identical to that explicitlydisclosed except that they exclude such prior art structure(s)/step(s),and shall accordingly be deemed as providing sufficient disclosure tosupport a corresponding negative limitation in a claim claiming suchalternative embodiment(s), which exclude such very different prior artstructure(s)/step(s) way(s).

From reading the present disclosure, other variations and modificationswill be apparent to persons skilled in the art. Such variations andmodifications may involve equivalent and other features which arealready known in the art, and which may be used instead of or inaddition to features already described herein.

Although Claims have been formulated in this Application to particularcombinations of features, it should be understood that the scope of thedisclosure of the present invention also includes any novel feature orany novel combination of features disclosed herein either explicitly orimplicitly or any generalization thereof, whether or not it relates tothe same invention as presently claimed in any Claim and whether or notit mitigates any or all of the same technical problems as does thepresent invention.

Features which are described in the context of separate embodiments mayalso be provided in combination in a single embodiment. Conversely,various features which are, for brevity, described in the context of asingle embodiment, may also be provided separately or in any suitablesubcombination. The Applicants hereby give notice that new Claims may beformulated to such features and/or combinations of such features duringthe prosecution of the present Application or of any further Applicationderived therefrom.

References to “one embodiment,” “an embodiment,” “example embodiment,”“various embodiments,” “some embodiments,” “embodiments of theinvention,” etc., may indicate that the embodiment(s) of the inventionso described may include a particular feature, structure, orcharacteristic, but not every possible embodiment of the inventionnecessarily includes the particular feature, structure, orcharacteristic. Further, repeated use of the phrase “in one embodiment,”or “in an exemplary embodiment,” “an embodiment,” do not necessarilyrefer to the same embodiment, although they may. Moreover, any use ofphrases like “embodiments” in connection with “the invention” are nevermeant to characterize that all embodiments of the invention must includethe particular feature, structure, or characteristic, and should insteadbe understood to mean “at least some embodiments of the invention”include the stated particular feature, structure, or characteristic.

References to “user”, or any similar term, as used herein, may mean ahuman or non-human user thereof. Moreover, “user”, or any similar term,as used herein, unless expressly stipulated otherwise, is contemplatedto mean users at any stage of the usage process, to include, withoutlimitation, direct user(s), intermediate user(s), indirect user(s), andend user(s). The meaning of “user”, or any similar term, as used herein,should not be otherwise inferred or induced by any pattern(s) ofdescription, embodiments, examples, or referenced prior-art that may (ormay not) be provided in the present patent.

References to “end user”, or any similar term, as used herein, isgenerally intended to mean late stage user(s) as opposed to early stageuser(s). Hence, it is contemplated that there may be a multiplicity ofdifferent types of “end user” near the end stage of the usage process.Where applicable, especially with respect to distribution channels ofembodiments of the invention comprising consumed retailproducts/services thereof (as opposed to sellers/vendors or OriginalEquipment Manufacturers), examples of an “end user” may include, withoutlimitation, a “consumer”, “buyer”, “customer”, “purchaser”, “shopper”,“enjoyer”, “viewer”, or individual person or non-human thing benefitingin any way, directly or indirectly, from use of or interaction, withsome aspect of the present invention.

In some situations, some embodiments of the present invention mayprovide beneficial usage to more than one stage or type of usage in theforegoing usage process. In such cases where multiple embodimentstargeting various stages of the usage process are described, referencesto “end user”, or any similar term, as used therein, are generallyintended to not include the user that is the furthest removed, in theforegoing usage process, from the final user therein of an embodiment ofthe present invention.

Where applicable, especially with respect to retail distributionchannels of embodiments of the invention, intermediate user(s) mayinclude, without limitation, any individual person or non-human thingbenefiting in any way, directly or indirectly, from use of, orinteraction with, some aspect of the present invention with respect toselling, vending, Original Equipment Manufacturing, marketing,merchandising, distributing, service providing, and the like thereof.

References to “person”, “individual”, “human”, “a party”, “animal”,“creature”, or any similar term, as used herein, even if the context orparticular embodiment implies living user, maker, or participant, itshould be understood that such characterizations are sole by way ofexample, and not limitation, in that it is contemplated that any suchusage, making, or participation by a living entity in connection withmaking, using, and/or participating, in any way, with embodiments of thepresent invention may be substituted by such similar performed by asuitably configured non-living entity, to include, without limitation,automated machines, robots, humanoids, computational systems,information processing systems, artificially intelligent systems, andthe like. It is further contemplated that those skilled in the art willreadily recognize the practical situations where such living makers,users, and/or participants with embodiments of the present invention maybe in whole, or in part, replaced with such non-living makers, users,and/or participants with embodiments of the present invention. Likewise,when those skilled in the art identify such practical situations wheresuch living makers, users, and/or participants with embodiments of thepresent invention may be in whole, or in part, replaced with suchnon-living makers, it will be readily apparent in light of the teachingsof the present invention how to adapt the described embodiments to besuitable for such non-living makers, users, and/or participants withembodiments of the present invention. Thus, the invention is thus toalso cover all such modifications, equivalents, and alternatives fallingwithin the spirit and scope of such adaptations and modifications, atleast in part, for such non-living entities.

Headings provided herein are for convenience and are not to be taken aslimiting the disclosure in any way.

The enumerated listing of items does not imply that any or all of theitems are mutually exclusive, unless expressly specified otherwise.

It is understood that the use of specific component, device and/orparameter names are for example only and not meant to imply anylimitations on the invention. The invention may thus be implemented withdifferent nomenclature/terminology utilized to describe themechanisms/units/structures/components/devices/parameters herein,without limitation. Each term utilized herein is to be given itsbroadest interpretation given the context in which that term isutilized.

Terminology

The following paragraphs provide definitions and/or context for termsfound in this disclosure (including the appended claims):

“Comprising” And “contain” and variations of them—Such terms areopen-ended and mean “including but not limited to”. When employed in theappended claims, this term does not foreclose additional structure orsteps. Consider a claim that recites: “A memory controller comprising asystem cache . . . .” Such a claim does not foreclose the memorycontroller from including additional components (e.g., a memory channelunit, a switch).

“Configured To.” Various units, circuits, or other components may bedescribed or claimed as “configured to” perform a task or tasks. In suchcontexts, “configured to” or “operable for” is used to connote structureby indicating that the mechanisms/units/circuits/components includestructure (e.g., circuitry and/or mechanisms) that performs the task ortasks during operation. As such, the mechanisms/unit/circuit/componentcan be said to be configured to (or be operable) for perform(ing) thetask even when the specified mechanisms/unit/circuit/component is notcurrently operational (e.g., is not on). Themechanisms/units/circuits/components used with the “configured to” or“operable for” language include hardware—for example, mechanisms,structures, electronics, circuits, memory storing program instructionsexecutable to implement the operation, etc. Reciting that amechanism/unit/circuit/component is “configured to” or “operable for”perform(ing) one or more tasks is expressly intended not to invoke 35U.S.C. .sctn.112, sixth paragraph, for thatmechanism/unit/circuit/component. “Configured to” may also includeadapting a manufacturing process to fabricate devices or components thatare adapted to implement or perform one or more tasks.

“Based On.” As used herein, this term is used to describe one or morefactors that affect a determination. This term does not forecloseadditional factors that may affect a determination. That is, adetermination may be solely based on those factors or based, at least inpart, on those factors. Consider the phrase “determine A based on B.”While B may be a factor that affects the determination of A, such aphrase does not foreclose the determination of A from also being basedon C. In other instances, A may be determined based solely on B.

The terms “a”, “an” and “the” mean “one or more”, unless expresslyspecified otherwise.

All terms of exemplary language (e.g., including, without limitation,“such as”, “like”, “for example”, “for instance”, “similar to”, etc.)are not exclusive of any other, potentially, unrelated, types ofexamples; thus, implicitly mean “by way of example, and not limitation .. . ”, unless expressly specified otherwise.

Unless otherwise indicated, all numbers expressing conditions,concentrations, dimensions, and so forth used in the specification andclaims are to be understood as being modified in all instances by theterm “about.” Accordingly, unless indicated to the contrary, thenumerical parameters set forth in the following specification andattached claims are approximations that may vary depending at least upona specific analytical technique.

The term “comprising,” which is synonymous with “including,”“containing,” or “characterized by” is inclusive or open-ended and doesnot exclude additional, unrecited elements or method steps. “Comprising”is a term of art used in claim language which means that the named claimelements are essential, but other claim elements may be added and stillform a construct within the scope of the claim.

As used herein, the phase “consisting of” excludes any element, step, oringredient not specified in the claim. When the phrase “consists of” (orvariations thereof) appears in a clause of the body of a claim, ratherthan immediately following the preamble, it limits only the element setforth in that clause; other elements are not excluded from the claim asa whole. As used herein, the phase “consisting essentially of” and“consisting of” limits the scope of a claim to the specified elements ormethod steps, plus those that do not materially affect the basis andnovel characteristic(s) of the claimed subject matter (see Norian Corp.v Stryker Corp., 363 F.3d 1321, 1331-32, 70 USPQ2d 1508, Fed. Cir.2004). Moreover, for any claim of the present invention which claims anembodiment “consisting essentially of” or “consisting of” a certain setof elements of any herein described embodiment it shall be understood asobvious by those skilled in the art that the present invention alsocovers all possible varying scope variants of any describedembodiment(s) that are each exclusively (i.e., “consisting essentiallyof”) functional subsets or functional combination thereof such that eachof these plurality of exclusive varying scope variants each consistsessentially of any functional subset(s) and/or functional combination(s)of any set of elements of any described embodiment(s) to the exclusionof any others not set forth therein. That is, it is contemplated that itwill be obvious to those skilled how to create a multiplicity ofalternate embodiments of the present invention that simply consistingessentially of a certain functional combination of elements of anydescribed embodiment(s) to the exclusion of any others not set forththerein, and the invention thus covers all such exclusive embodiments asif they were each described herein.

With respect to the terms “comprising,” “consisting of,” and “consistingessentially of,” where one of these three terms is used herein, thedisclosed and claimed subject matter may include the use of either ofthe other two terms. Thus in some embodiments not otherwise explicitlyrecited, any instance of “comprising” may be replaced by “consisting of”or, alternatively, by “consisting essentially of”, and thus, for thepurposes of claim support and construction for “consisting of” formatclaims, such replacements operate to create yet other alternativeembodiments “consisting essentially of” only the elements recited in theoriginal “comprising” embodiment to the exclusion of all other elements.

Moreover, any claim limitation phrased in functional limitation termscovered by 35 USC § 112(6) (post AIA 112(f)) which has a preambleinvoking the closed terms “consisting of,” or “consisting essentiallyof,” should be understood to mean that the corresponding structure(s)disclosed herein define the exact metes and bounds of what the soclaimed invention embodiment(s) consists of, or consisting essentiallyof, to the exclusion of any other elements which do not materiallyaffect the intended purpose of the so claimed embodiment(s).

Devices or system modules that are in at least general communicationwith each other need not be in continuous communication with each other,unless expressly specified otherwise. In addition, devices or systemmodules that are in at least general communication with each other maycommunicate directly or indirectly through one or more intermediaries.Moreover, it is understood that any system components described or namedin any embodiment or claimed herein may be grouped or sub-grouped (andaccordingly implicitly renamed) in any combination or sub-combination asthose skilled in the art can imagine as suitable for the particularapplication, and still be within the scope and spirit of the claimedembodiments of the present invention. For an example of what this means,if the invention was a controller of a motor and a valve and theembodiments and claims articulated those components as being separatelygrouped and connected, applying the foregoing would mean that such aninvention and claims would also implicitly cover the valve being groupedinside the motor and the controller being a remote controller with nodirect physical connection to the motor or internalized valve, as suchthe claimed invention is contemplated to cover all ways of groupingand/or adding of intermediate components or systems that stillsubstantially achieve the intended result of the invention.

A description of an embodiment with several components in communicationwith each other does not imply that all such components are required. Onthe contrary a variety of optional components are described toillustrate the wide variety of possible embodiments of the presentinvention.

As is well known to those skilled in the art many careful considerationsand compromises typically must be made when designing for the optimalmanufacture of a commercial implementation any system, and inparticular, the embodiments of the present invention. A commercialimplementation in accordance with the spirit and teachings of thepresent invention may configured according to the needs of theparticular application, whereby any aspect(s), feature(s), function(s),result(s), component(s), approach(es), or step(s) of the teachingsrelated to any described embodiment of the present invention may besuitably omitted, included, adapted, mixed and matched, or improvedand/or optimized by those skilled in the art, using their average skillsand known techniques, to achieve the desired implementation thataddresses the needs of the particular application.

In the following description and claims, the terms “coupled” and“connected,” along with their derivatives, may be used. It should beunderstood that these terms are not intended as synonyms for each other.Rather, in particular embodiments, “connected” may be used to indicatethat two or more elements are in direct physical or electrical contactwith each other. “Coupled” may mean that two or more elements are indirect physical or electrical contact. However, “coupled” may also meanthat two or more elements are not in direct contact with each other, butyet still cooperate or interact with each other. “Thermally Coupled”means that elements are able to transfer heat, possibly indirectly, fromone to the other. “Thermal Communication” refers to the transfer ofheat, possibly indirectly, from one element to another.

It is to be understood that any exact measurements/dimensions orparticular construction materials indicated herein are solely providedas examples of suitable configurations and are not intended to belimiting in any way. Depending on the needs of the particularapplication, those skilled in the art will readily recognize, in lightof the following teachings, a multiplicity of suitable alternativeimplementation details.

FIGS. 1A-1C illustrate an exemplary heat riser apparatus constructed ofthermally conductive material, wherein FIG. 1A shows a perspective viewof a heat riser apparatus, FIG. 1B shows a first side view of a heatriser apparatus, and FIG. 1C shows a second cross-section of a heatriser apparatus, in accordance with an embodiment of the presentinvention. With reference to FIGS. 1A-1C, heat riser apparatus 100 maycomprise upper block 110 and lower block 130 wherein said blocks appearin a stacked configuration. Lower block 130 may include two majorsurfaces: lower surface 140 of heat riser 100, and upper cylindricalsurface 120. Upper block 110 may also include two major surfaces: uppersurface 105 of heat riser apparatus 100 and lower cylindrical surface115. Lower block 130 may make contact with lower cylindrical surface 115of upper block 110 via upper cylindrical surface 120. Depending on theforce applied to upper block 110, lower cylindrical surface 115 mayslide along upper cylindrical surface 120 and make heat riser apparatus100 adaptable to a variety of different server and electronic componentconfigurations, and thereby allowing for vertical and horizontal axialelastic adjustment while providing consistent pressure to both a saidheat source and a cooling source to provide for adequate heat dispersionalong a thermal pathway. Upper block 110 may slide along lower block 130in axial direction 145, as shown in FIG. 1B, as well as radial direction150, similar to a concave cylindrical depressions and convex cylindricalprotrusion, as shown in FIG. 1C. When sliding along axial direction 145,upper surface 105 may be lifted or lowered, and may be able toaccommodate for taller or shorter server configurations, respectively.Additionally, while rotating in radial direction 150, upper surface 105may be tilted. The combination of movement in axial direction 145 andradial direction 150 may allow for heat riser apparatus 100 tocompensate for differences in positional requirements for various serverconfigurations. Lower block 130 may be mounted to, for example, withoutlimitation, a motherboard, and make direct contact with a heat source tobe cooled. Heat may be transferred from the heat source into heat riserapparatus through lower surface 140 of lower block 130.

In order to maintain a position of upper block 110, a predeterminedamount of force may be applied to upper block 110, said forcedetermining the amount of pressure that may be applied to the heatsource by heat riser apparatus 100. In a preferred embodiment, the forceapplied to upper block 110 may be determined such that the force isgreat enough to ensure a secure abutment of upper block 110 againstlower block 130, said abutment unimpaired by, for example, withoutlimitation, gravity or accelerating forces due to vibration. Theseblocks may be elastically coupled. Simultaneously, the force may belimited so pressure from lower block 130 is not great enough to damagethe heat source or any supporting electrical components. As will beappreciated by one skilled in the art, selection of elastic componentsmay be based on a variety of different factors depending on, forexample, without limitation, the type of the heat source, the type ofthe PCB, the tolerance of the cold plate or other contacts contactingupper surface 105, etc. Because there may be substantial variabilitybetween different systems, the selection of elastic components 135 mayvary from system to system, and may be determined by, for example,without limitation, the schematic diagrams to be described withreference to FIG. 4 below. The force applied to upper block 110 may beapplied through first elastic components 125 and second elasticcomponents 135. Second elastic components 135 may be mounted at angles155 and 160 depending on the specific structural needs of the server orcomponent configuration. Angles 155 and 160 may depend on, for example,without limitation, the amount of movement in axial direction 145, theamount of movement in radial direction 150, pressure placed on the heatsource, strain on second elastic components 135, etc. A static forcedecomposition of first elastic components 125 and second elasticcomponents 135 may indicate an ideal selection of magnitude anddirection of force caused by the elastic components, which may in turncreate an optimal and stable press force on contacting surfaces forminimal thermal contact resistance without sacrificing reliability.

The elastic components 135 in combination with the stacked blocks110/130 create a sliding mechanism to achieve an automatic tolerancecompensation approach. The sliding mechanism comprises the incline ofthe lower block 130 and the complemental incline of the block directlyabove the lower block, which in some cases may be an upper block 110 ora middle block 1104 (seen in FIGS. 11A-11C), elastically engaging,wherein the lower block 130 may be statically mounted and the blockdirectly above the lower block may be dynamically slidable from use ofelastic components 135 that are mounted at an angles 155 and 160. Thisangulation assists with the pressure requirements in order to provide anautomatic tolerance compensation. The elastic limits are configured tobe in a range of tensions that provide for secured couplement, but donot produce excess pressure that may damage any of the componentsherein.

Optionally, one or more of lower block 130 and upper block 110 mayinclude vapor chambers to enhance the heat dissipation capability ofheat riser apparatus 100 up to, for example, without limitation, 500 Wper CPU under the limits of internal server volume. Vapor chambers willbe discussed in greater detail below with respect to FIGS. 2A-2C.Additionally, thermal grease may be used on various surfaces of heatriser 100 and surrounding server components, including, for example,without limitation, on upper surface 105, lower cylindrical surface 115,upper cylindrical surface 120, lower surface 140, etc. to minimizethermal resistance.

FIGS. 2A-2C illustrate exemplary vapor chambers of a heat riserapparatus, wherein FIG. 2A shows a cross-sectional view of a heat riserapparatus in a default position, FIG. 2B shows a cross-sectional view ofa heat riser apparatus in a sliding up position, and FIG. 2C shows avapor chamber, in accordance with an embodiment of the presentinvention. With reference to FIGS. 1A-1C and FIGS. 2A-2C, Vapor chambersmay be integrated with heat riser apparatus 100 for increased heatdissipation performance. Upper block 110 may contain upper vapor chamber215, while lower block 130 may contain lower vapor chamber 220.Additionally, upper vapor chamber 215 and lower vapor chamber 220 mayremain aligned while heat riser apparatus 100 is in defaultconfiguration 205, or offset while heat riser apparatus 100 is insliding up configuration 210. Vapor chambers may be utilized in theaforementioned design of heat riser 210 in multiple ways. For example,without limitation, a vapor chamber may be inserted into one or more oflower block 130 and upper block 110. The vapor chamber 260 may bepre-sealed prior to being inserted into a hollowed out cavity or void.Initially, lower block 130 and upper block 110 may be machined with oneor more vapor chambers. The vapor chambers may then be pushed into thereserved cavities of upper block 110 and/or lower block 130. Tightfitting between upper block 110, lower block 130, and the vapor chambersmay be adopted for low contacting thermal resistance. In an alternativeembodiment, vapor chambers may be manufactured directly in the cavitiesof upper block 110 and/or lower block 130. In this case, the walls ofsaid vapor chamber 260 make up the walls of each block. However, thismethod may require a large capital investment, and may not be preferablewhen compared to inserting the vapor chambers.

The internal mechanics of upper vapor chamber 215 and lower vaporchamber 220 are described with reference to FIG. 2C. Vapor chamber 260may be used to transfer heat from heat source/condenser 235 to heatsink/condenser 250. For lower vapor chamber 220, heat source 235 may bethe computer component to be cooled and heat sink 250 may be upper vaporchamber 215. Similarly, for upper vapor chamber 220, heat source 235 maybe lower vapor chamber 220 while heat sink 250 may be a cold plate. Thevapor chamber includes an outer container 230 and wick 225. Heat may betransferred from heat source 235 and spread to heat sink 250 usingforced convection of liquid 240. Liquid 240 may be contained in wick 225along the interior surface of vapor chamber 260. As liquid 240 may beheated by heat source 235, liquid 240 may become vapor 245 and spread tothe upper surface of vapor chamber 250. Vapor 245 may then condense onthe surfaces of heat sink 250, and capillary forces in wick 225 mayreturn the condensed vapor back to heat source 235. The mechanics of avapor chamber may also provide improved thermal connection between upperblock 110 and lower block 130 by way of a thermal pathway. When theupper block 110 is slid relative to lower block 130, the surface area ofthe contact point is reduced. The mechanics of vapor chambers directwhere the warmer vapors will go by influencing the vapors to seek out acolder source to disburse the heat. As such, the warm vapors willnaturally target and accumulate at the connection point between the twoblocks and avoid excess heat accumulation in areas are not directly incommunication with the upper block 110.

Because heat transfer occurs on the cold and hot surfaces of vaporchamber 260 in the form of latent heat, a higher overall heat conductivecoefficient may be achieved when compared to, for example, withoutlimitation, copper, which may eventually reduce the overall heatresistance of heat riser 210. The effective thermal conductivity ofvapor chamber 260 may typically be 435.6-557.9 W/m·K, which may be animprovement over copper with a typical effective thermal conductivity of385 W/m·K.

FIGS. 3A-3B illustrate an exemplary heat riser apparatus mounted withina server, wherein FIG. 3A shows a perspective view of a heat riserapparatus mounted within a server, and FIG. 3B shows a cross section ofa heat riser apparatus mounted within a server, in accordance with anembodiment of the present invention. With reference to both FIGS. 1A-1Cand FIGS. 3A-3B, heat riser apparatus 100 may be mounted to, forexample, without limitation, heat source 310 of server 305. Heat source310 may be any type of computer component known in the art, such as,without limitation, a central processing unit (CPU), graphics processingunit (GPU), and any other type of chip or electronic device, includingpower supplies, with the top plane to be attached. Additionally,integration of heat riser apparatus 100 within server 305 may also lowerthe ambient temperature within server 305, cooling other nearbycomponents. Lower surface 140 of heat riser apparatus 100 may be placedon top of upper surface 320 of heat source 310 in order to transfer heatfrom heat source 310 into heat riser apparatus 100. Additionally, uppersurface 105 of heat riser apparatus 100 may be adjacent to lower surface315 of cold plate 325. Thus, heat transferred into heat riser apparatus100 may be transferred into cold plate 325 for dissipation. Cold plate325 may be integrated into the lid of server 305, as will be describedbelow with reference to FIGS. 6A-6C.

FIG. 4 illustrates a schematic diagram of an exemplary heat riserapparatus, in accordance with an embodiment of the present invention.With reference to FIGS. 1A-1C, FIGS. 3A-3B, and FIG. 4, a schematicdiagram may be used to evaluate various aspects of heat riser apparatus100, especially, for example, without limitation, the force placed uponthe CPU or other computer component. As shown, cold plate 325 may sit ontop of upper block 110, which may sit on top of lower block 130, andlower block 130 may be mounted on top of, for example, withoutlimitation, a CPU (not shown). The schematic diagram may be describedwith reference to the following symbols, wherein: f_(p) may be thesupporting force from lower block 130, P_(p) may be the pressure on thecontacting surface between lower block 130 and upper block 110, f_(f)may be frictional force, f_(c) may be the pressure from cold plate 325,f_(s) may be the force from the spring (i.e. the elastic components), μmay be the friction coefficient, f_(cpu) may be the force on the CPU, αmay be the angle of the inclined upper surface of lower block 130, β maybe the angle between an elastic component and the inclined upper surfaceof lower block 130, k may be the stiffness of the elastic component, ΔLmay be the deformation of the spring, ΔHor may be the horizontaldisplacement of upper block 110, and ΔVer may be the verticaldisplacement of upper block 110.

A possible description of the amount of force applied from upper block110 applied to cold plate 325 may be described byf_(p)=(f_(c)+G)*cos(α)+f_(s)*sin(β). The force balance along an Xdirection may be described by f_(s)*cos(β)=(f_(c)+G)*sin(α)+f_(f). Theschematic diagram along the y direction may be described byf_(s)*cos(β)=(f_(c)+G)*sin(α)−μ*((f_(c)+G)*cos(α)+f_(s)*sin(β)). Theforce applied on the CPU may be described byf_(cpu)=(f_(c)+G)+f_(s)*cos(90°−β+α). The ratio of force magnitudeapplied by the elastic components and by cold plate 325 may bef_(s)/(f_(c)+G)=(sin(α)−μ*cos(α))/(cos(β)+μ*sin(β)). The extension ofthe elastic component may be described by Δx=−f_(s)/k. The frictionforce between upper block 110 and lower block 130 may be described byf_(f)=μ*(−f_(p)). While the aforementioned formulas may be used todescribe various aspects of heat riser apparatus 100, as will beappreciated by one skilled in the art, fewer or additional formulas maybe used in analyzing heat riser apparatus 100, and should not be limitedsolely to the formulas described above.

FIG. 5 illustrates an exemplary heat riser mounting, in accordance withan embodiment of the present invention. Heat riser apparatus 100 may beadapted to fit many different mounting mechanisms, and thus may be ableto be used in many different computing systems. In many cases, printedcircuit board (PCB) 500 may include four mounting holes 520 withinternal diameter 505 and external diameter 510. While many differentmounting configurations may be possible, internal diameter 505 may be,for example, without limitation, 3 mm in diameter, and external diameter510 may be, for example, without limitation 5 mm in diameter, creatingconcentric rings 515 which may be the contact area between PCB 500 andheat riser apparatus 100. As will be appreciated by one skilled in theart, many different mounting mechanisms may be used in combination withheat riser apparatus 100, and heat riser apparatus 100 may not belimited to being mounted in the configuration described above. Thespecific interface may vary depending on a variety of different factors,such as, without limitation, CPU brand, clearance factors, etc. Fordifferent mounting configurations, it may be important to adjust theelastic components to accommodate for a variety of different systems andensure tight contact and proper stress on PCB 500.

FIGS. 6A-6C illustrate an exemplary modified server cover, wherein FIG.6A shows a conventional 2U server, FIG. 6B shows a server with a mountedmodified server cover, and FIG. 6C shows a bottom view of a modifiedserver cover, in accordance with an embodiment of the present invention.While heat riser apparatus 100 may be integrated into many serverenvironments without modification of the server, in some cases, it maybe necessary to alter the lid of an existing server in order toaccommodate for a liquid cooled cold plate for optimal heat dissipation.For example, without limitation, FIG. 6A shows server 600 without a coldplate, and may comprise removable server cover 605 and server chassis610. Server 600 may be a conventional 2U server, and may subsequentlyincorporate heat riser apparatus 100. As it would be desirable for theupper surface of heat riser apparatus 100 to be in contact with a coldplate, removable server cover 605 may be replaced with a separateembodiment with an incorporated cold plate, as shown in FIGS. 6B-6C.Replacement cover 615 may be used to incorporate cold plate 630 intoserver 600. Replacement cover 615 may include inlet 620 and outlet 625for cycling liquid in and out of cold plate 630. Inlet 620 and outlet625 may be dripless, quick-connect connectors for ease of set up and theprevention of spills. Replacement cover 615 may have the same lockingmechanism as server cover 605 to allow for a seamless integration withserver chassis 610. Cold plate 630 may be included on the underside ofreplacement cover 615 and may come into direct contact with the uppersurface of heat riser apparatus 100 while also passively cooling theinterior environment of server 600.

FIGS. 7A-7B illustrate exemplary server measurements, wherein FIG. 7Ashows the height of an exemplary server, and FIG. 7B shows a side viewof an exemplary server, in accordance with an embodiment of the presentinvention. With reference to both FIGS. 6A-6C and FIGS. 7A-7B,conventional server implementations typically use a rack system fororganization, and may use a standardization for height between 1U and4U. A conventional server system may use rack 700 to mount differentservers, and rack 700 may include mounting holes 705 to be used withservers with heights between 1U and 4U. With replacement cover 615mounted on server chassis 610, extra height may be added to server 600.With replacement cover height 710 being 0.5U and server chassis height715 being 2.0U, the height of server 600 may become 2.5U withreplacement cover 615, which may still be mountable on server rack 700.Additionally, replacement cover 700 may be integrated with otherpre-existing server heights. For example, without limitation, a 1Userver may include a 0.5U height replacement cover, and a 3U server mayinclude a 1U height replacement cover, etc.

FIGS. 8A-8C illustrates a stress diagram of an exemplary heat riserapparatus, wherein FIG. 8A shows a heat riser apparatus with totaldeformation, FIG. 8B shows a heat riser apparatus with straindistribution on all components, and FIG. 8C shows a heat riser apparatuswith an even distribution of stress on elastic components, in accordancewith an embodiment of the present invention. With reference to FIGS.1A-1C and FIGS. 8A-8C, stress analysis together with the calculationbased on the equations in FIG. 4 may be used to determine, for example,without limitation, mounting placement of elastic components 135,elasticity of elastic components 135, height of heat riser 100, radialand axial displacement of upper block 110, etc. As shown in FIG. 8A,total deformation of heat riser apparatus 100 is shown, with variablestress on elastic components 135 while upper block 110 is pushed into adownward position. Such a configuration of heat riser apparatus 100 isnot desirable, and further tweaking of the configuration of heat riserapparatus 100 must be done for optimal heat dissipation results andlongevity of the cooling system. As shown in FIG. 8B, there is a stressdistribution on elastic components 135 and throughout heat riserapparatus 100, and low stress concentration on the system in general. Insuch a configuration, longevity of heat riser apparatus 100 may beachieved. As shown in FIG. 8C, while there is an even amount of stressthroughout heat riser apparatus 100, an additional amount of stress isplaced on elastic components 135. Such a configuration, while not ideal,may be an adequate solution for some server configurations. Theaforementioned three examples shown in FIGS. 8A-8C illustrate theimportance of strain and stress simulation on heat riser apparatus 100,as heat riser apparatus 100 may be adapted to being used in a variety ofdifferent server configurations. Simulation software may be used incombination with the multi-dimensional tolerance compensation of heatriser apparatus 100 may allow heat riser apparatus 100 to take on anoptimal configuration depending on the server environment.

FIGS. 9A-9C illustrates thermal simulation of an exemplary heat riserapparatus, wherein FIG. 9A shows a physical model of a heat riserapparatus, FIG. 9B shows a temperature gradient and thermal pathway of aheat riser apparatus, and FIG. 9C shows a bottom view of a temperaturegradient of a heat riser apparatus, in accordance with an embodiment ofthe present invention. With reference to FIGS. 1A-1C and FIGS. 9A-9C,before, after, or during stress or strain simulation of heat riserapparatus 100, thermal performance simulation may also be performed.Thermal performance of heat riser apparatus 100 may focus on atemperature differential under certain heat flux density conditions ofvarious heat sources. Thermal performance simulation may also be used tocompare and contrast the performance of heat riser apparatus 100 withmore conventional approaches, such as, without limitation, air-cooledheat sinks. In the following simulations, heat riser apparatus 100 maybe assumed to be in contact with a constant 35° C. and attached to heatsources with 500 W flow flux. As will be appreciated by one skilled inthe art, various different simulation variables may be used depending onthe needs of the specific system to which heat riser apparatus 100 willbe installed. As shown in the results of thermal performance simulationin FIGS. 9B-9C, the temperature gradient of lower block 130 is higherthan that of upper block 110, which may require further optimization ofheat riser apparatus 100 to ensure ideal heat dissipation capabilitiesof the thermally coupled blocks. Further, the temperature in the centerof bottom surface 140 of lower block 130 is shown to be 53° C., whichmay be within preferred ranges for a CPU.

FIGS. 10A-10C illustrate an exemplary simplified heat riser, whereinFIG. 10A shows a prospective view of a simplified heat riser, FIG. 10Bshows a cross section of a simplified heat riser, and FIG. 10C shows across section of a simplified heat riser at sliding-up conditions, inaccordance with an embodiment of the present invention. Simplified heatriser 1000 may be the simplest embodiment of the present invention,wherein the surface between upper block 1010 and lower block 1020 maycomprise a flat plane. Because simplified heat riser 1000 is lesssophisticated than the embodiment described above with reference toFIGS. 1A-1C, simplified heat riser 100 may be easier to be machined.However, other difficulties may arise in machining other components of aserver such as, without limitation, heat sources, cold plates, a lockingmechanism of a server lid, etc. as this planar contacting may onlyabsorb the clearance in the Z (i.e. upwards) direction. As such, theuniversal server chassis, cold plate, and heat sources may need to beredesigned for tight clearance control when incorporating simplifiedheat riser 1000. Simplified heat riser 1000 may be placed between a heatsource and a cold plate in order to provide for heat dissipation of theheat source. Lower surface 1025 of simplified heat riser 1000 maycontact a top surface of the heat source to ensure that heat generatedby the heat source may be conducted to simplified heat riser 1000.Similarly, top surface 1005 of simplified heat riser 1000 may be pressedto contact with a lower surface of a cold plate to let heat flow fromsimplified heat riser 1000 to the cold plate. Therefore, the mainfunction of simplified heat riser 1000 may be to transfer heat from aheat source to a cold plate.

Simplified heat riser 1000 may comprise upper block 1010 and lower block1020. Lower block 1020 may have two major surfaces: lower surface 1025and upper inclined plane 1055. Likewise, upper block 1010 may have twomajor surfaces: upper surface 1005 and lower inclined plane 1050. Lowerblock 1020 may be opposite to upper block 1010, and upper inclined plane1055 of lower block 1020 may make contact with lower inclined plane 1050of upper block 1010. Lower block 1020 may be mounted to a motherboardand make direct contact with a heat source in need of heat dissipation.Upper block 1010 may slide via translation along axial direction 1040 ofthe coupled inclined plane comprising upper inclined plane 1055 andlower inclined plane 1050 by angle 1065 between a default configurationas shown in FIG. 10B and a sliding-up configuration as shown in FIG.10C. While upper block 1010 translates along axial direction 1040, uppersurface 1005 of simplified heat riser 1000 may be either lifted orlowered so that upper surface 1005 may make solid contact with the lowersurface of the cold plate. In order to hold upper block 1010 in aposition in which it abuts against lower block 1020 as well as the lowersurface of the cold plate, a predetermined amount of force may beapplied to upper block 1010, said force determining the force ofpressure that, taking friction into consideration, is exerted by upperblock 1010 on lower block 1020 and the cold plate. Preferably, the forcemay be selected such that the force is great enough to ensure a secureabutment of upper block 1010 against lower block 1020 and the coldplate, said abutment unimpaired by gravity or accelerating forces due tovibration. At the same time, the force may be limited so that lowerblock 1020 and heat sources, such as, without limitation, a chip on amotherboard, do not incur any damage. The force may be applied usingelastic components 1035, in which distal ends of each elastic component1035 may be screwed to upper block 1010 and lower block 1020. Elasticcomponents 1035 may be mounted symmetrically at an angle against horizon1030, as shown in FIG. 10A. The static force decomposition of elasticforce from elastic components 1035 may indicate that if the elasticforce of elastic components, including, for example, without limitation,magnitude and direction, may be selected, an optimal and stable pressforce on the contacting surfaces of simplified heat riser 1000 forminimal thermal contact resistance may be achieved without sacrificingreliability.

Edges 1015 located at both sides of lower block 1020 may symmetricallywork together with upper inclined plane 1055 as a guiding mechanism ofupper block 1010. Alternatively, edges 1015 may be located at eitherside of upper block 1010 to symmetrically work together with lowerinclined plane 1050 as a guiding mechanism of upper block 1010.

One or more of lower block 1020 and upper block 1010 may include vaporchambers such as, but not limited to, upper vapor chamber 1045 and lowervapor chamber 1060 to enhance the heat dissipation capabilities ofsimplified heat riser 1000 up to 500 W per CPU under the limits ofinternal server volume. As will be appreciated by one skilled in theart, a plurality of multiple vapor chambers may be incorporated intoeither or both of upper block 1010 and lower block 1020, and may not belimited to only upper vapor chamber 1045 and lower vapor chamber 1060.Additionally, the gap between the lower surface of the cold plateagainst top surface 1005 and the gap between the upper surface of theheat source and lower surface 1025 may be filled with thermal grease tominimize thermal resistance. Because the cold plate may be on top of theserver other minor heat sources such as, without limitation, the GPU,memory, drivers, etc. may be cooled through natural convection.

FIGS. 11A-11C illustrate an exemplary triple block heat riser, whereinFIG. 11A shows a prospective view of a triple block heat riser, FIG. 11Bshows an exploded view of a triple block heat riser, and FIG. 11C showsa cross-sectional view of a triple block heat riser, in accordance withan embodiment of the present invention. Triple block het riser 1100 maycomprise upper block 1102, middle block 1104, and lower block 1106,wherein the contacting surface between upper block 1102 and middle block1104 may be a spherical surface, with one surface having a generallyconcave depression form and one having a generally convex protrusionform, and the contacting surface between middle block 1104 and lowerblock 1106 may be a flat plane. As such, triple block heat riser 1100may compensate for clearance in three directions, at the cost of costefficiency in machining the two spherical surfaces of upper block 1102and middle block 1104. Triple block heat riser 1100 may be placedbetween a cold plate and a heat source to transfer heat from the heatsource to the cold plate. Lower surface 1130 of triple block heat riser1100 may make direct contact with the top surface of the heat source toensure that heat generated by the heat source may be conducted to tripleblock heat riser 1100. Similarly, top surface 1114 of triple block heatriser 1100 may be pressed to contact with the lower surface of the coldplate to allow heat to flow from triple block heat riser 1100 to thecold plate. Lower block 1106 may have two major surfaces: lower surface1130 and upper inclined plane 1128. Middle block may have two majorsurfaces: lower inclined plane 1124 and upper spherical surface 1120.Similarly, upper block may have two major surfaces: lower sphericalsurface 1118 and upper surface 1114. Lower block 1106 may be opposite toand make contact with middle block 1104 at upper inclined plane 1128 oflower block 1106 and lower inclined plane 1124 of middle block 1104.Lower block 1106 may be mounted on a motherboard and make direct contactwith the heat source for optimal heat dissipation. Middle block 1104together with upper block 1102 may slide by translation along axialdirection 1134 of the coupled incline plane comprising lower inclinedplane 1124 and upper inclined plane 1128. When upper block 1102 togetherwith middle block 1104 are translated along axial direction 1134, topsurface 1114 of triple block heat riser 1100 may either be lifted orlowered, depending on the needs of the particular system. Meanwhile,upper block 1102 may also be rotated around via the sphere joint formedfrom upper spherical surface 1120 and lower spherical surface 1118. Withthe combination of lifting and lowering upper block 1102, top surface1114 may compensate for a positional tolerance between the top surface1114 and the lower surface of the cold plate in the X, Y, and Zdirections.

In order to hold middle block 1104 in a position in which middle block1104 abuts against lower block 1106 as well as against the cold plate,it is possible to apply a predetermined force to middle block 1104, saidforce determining the force of pressure that, taking into consideration,for example, without limitation, friction, may be exerted by middleblock 1104 on lower block 1106 and the cold plate. Preferably, the forcemay be selected such that the force is great enough to ensure a secureabutment of middle block 1104 against lower block 1105 and the coldplate, such abutment unimpaired by gravity or accelerating forces due tovibration. Simultaneously, the force may be limited such that damage tolower block 1106 and the heat source, such as, without limitation, achip mounted to a motherboard, may not be incurred. The force may beapplied by elastic elements, which may be screwed to middle block 1104and lower block 1106. Elastic components 1110 may be mountedsymmetrically and adjusted at an angle against horizon 1112. The staticforce decomposition of elastic force from elastic components 1110,including, for example, without limitation, magnitude and direction, maybe selected such that optimal and stable press force on the contactingsurfaces of triple block heat riser 1100 for minimal thermal contactresistance may be achieved without sacrificing reliability.

In order to hold upper block 1102 in a position in which it abutsagainst middle block 1104, a predetermined force may be applied tomiddle block 1104 and upper block 1102 by elastic components 1108, whichmay be installed vertically at upper block corners 1116 and middle blockcorners 1122. Preferably, the force may be selected such that the forceis great enough to ensure a secure abutment of middle block 1104 againstupper block 1102, said abutment unimpaired by gravity or acceleratingforces due to vibration and achieve reasonable contact thermalresistance.

Edges 1126 may be located at either side of lower block 1106 of tripleblock heat riser 1100, and may symmetrically work together with upperinclined plane 1128 as a guiding mechanism for middle block 1104.Alternatively, edges 1126 may be located at either side of middle block1104, and may symmetrically work together with lower inclined plane 1124as a guiding mechanism for middle block 1104.

One or more of lower block 1106 and middle block 1104 may include vaporchambers, such as, without limitation, middle vapor chamber 1132 andlower vapor chamber 1138, which may enhance heat dissipationcapabilities up to 500 W per CPU under the limits of internal servervolume. Further, the gap between the lower surface of the cold plate andtop surface 1114, the gap between lower spherical surface 1118 and upperspherical surface 1120, the gap between lower inclined plane 1124 andupper inclined plane 1128, and the gap between lower surface 1130 andthe upper surface of the heat riser may be filled with thermal grease tominimize thermal resistance. Because the cold plate may be on top of theserver, other minor heat sources, such as, without limitation, a GPU,memory, drivers, etc. may be cooled by the cold plate through naturalconvection.

All the features disclosed in this specification, including anyaccompanying abstract and drawings, may be replaced by alternativefeatures serving the same, equivalent or similar purpose, unlessexpressly stated otherwise. Thus, unless expressly stated otherwise,each feature disclosed is one example only of a generic series ofequivalent or similar features.

It is noted that according to USA law 35 USC § 112 (1), all claims mustbe supported by sufficient disclosure in the present patentspecification, and any material known to those skilled in the art neednot be explicitly disclosed. However, 35 USC § 112 (6) requires thatstructures corresponding to functional limitations interpreted under 35USC § 112 (6) must be explicitly disclosed in the patent specification.Moreover, the USPTO's Examination policy of initially treating andsearching prior art under the broadest interpretation of a “mean for” or“steps for” claim limitation implies that the broadest initial search on35 USC § 112(6) (post AIA 112(f)) functional limitation would have to beconducted to support a legally valid Examination on that USPTO policyfor broadest interpretation of “mean for” claims. Accordingly, the USPTOwill have discovered a multiplicity of prior art documents includingdisclosure of specific structures and elements which are suitable to actas corresponding structures to satisfy all functional limitations in thebelow claims that are interpreted under 35 USC § 112(6) (post AIA112(f)) when such corresponding structures are not explicitly disclosedin the foregoing patent specification. Therefore, for any inventionelement(s)/structure(s) corresponding to functional claim limitation(s),in the below claims interpreted under 35 USC § 112(6) (post AIA 112(f)),which is/are not explicitly disclosed in the foregoing patentspecification, yet do exist in the patent and/or non-patent documentsfound during the course of USPTO searching, Applicant(s) incorporate allsuch functionally corresponding structures and related enabling materialherein by reference for the purpose of providing explicit structuresthat implement the functional means claimed. Applicant(s) request(s)that fact finders during any claims construction proceedings and/orexamination of patent allowability properly identify and incorporateonly the portions of each of these documents discovered during thebroadest interpretation search of 35 USC § 112(6) (post AIA 112(f))limitation, which exist in at least one of the patent and/or non-patentdocuments found during the course of normal USPTO searching and orsupplied to the USPTO during prosecution. Applicant(s) also incorporateby reference the bibliographic citation information to identify all suchdocuments comprising functionally corresponding structures and relatedenabling material as listed in any PTO Form-892 or likewise anyinformation disclosure statements (IDS) entered into the present patentapplication by the USPTO or Applicant(s) or any 3^(rd) parties.Applicant(s) also reserve its right to later amend the presentapplication to explicitly include citations to such documents and/orexplicitly include the functionally corresponding structures which wereincorporate by reference above.

Thus, for any invention element(s)/structure(s) corresponding tofunctional claim limitation(s), in the below claims, that areinterpreted under 35 USC § 112(6) (post AIA 112(f)), which is/are notexplicitly disclosed in the foregoing patent specification, Applicant(s)have explicitly prescribed which documents and material to include theotherwise missing disclosure, and have prescribed exactly which portionsof such patent and/or non-patent documents should be incorporated bysuch reference for the purpose of satisfying the disclosure requirementsof 35 USC § 112 (6). Applicant(s) note that all the identified documentsabove which are incorporated by reference to satisfy 35 USC § 112 (6)necessarily have a filing and/or publication date prior to that of theinstant application, and thus are valid prior documents to incorporatedby reference in the instant application.

Having fully described at least one embodiment of the present invention,other equivalent or alternative methods of implementing a heat riserapparatus according to the present invention will be apparent to thoseskilled in the art. Various aspects of the invention have been describedabove by way of illustration, and the specific embodiments disclosed arenot intended to limit the invention to the particular forms disclosed.The particular implementation of the heat riser apparatus may varydepending upon the particular context or application. By way of example,and not limitation, the heat riser apparatus described in the foregoingwere principally directed to computer component cooling implementations;however, similar techniques may instead be applied to coolingtelecommunication equipment, IGBT power electronic devices and modules,high-power semiconductor diode lasers, etc., which implementations ofthe present invention are contemplated as within the scope of thepresent invention. The invention is thus to cover all modifications,equivalents, and alternatives falling within the spirit and scope of thefollowing claims. It is to be further understood that not all of thedisclosed embodiments in the foregoing specification will necessarilysatisfy or achieve each of the objects, advantages, or improvementsdescribed in the foregoing specification.

Claim elements and steps herein may have been numbered and/or letteredsolely as an aid in readability and understanding. Any such numberingand lettering in itself is not intended to and should not be taken toindicate the ordering of elements and/or steps in the claims.

The corresponding structures, materials, acts, and equivalents of allmeans or step plus function elements in the claims below are intended toinclude any structure, material, or act for performing the function incombination with other claimed elements as specifically claimed.

The corresponding structures, materials, acts, and equivalents of allmeans or step plus function elements in the claims below are intended toinclude any structure, material, or act for performing the function incombination with other claimed elements as specifically claimed. Thedescription of the present invention has been presented for purposes ofillustration and description, but is not intended to be exhaustive orlimited to the invention in the form disclosed. Many modifications andvariations will be apparent to those of ordinary skill in the artwithout departing from the scope and spirit of the invention. Theembodiment was chosen and described in order to best explain theprinciples of the invention and the practical application, and to enableothers of ordinary skill in the art to understand the invention forvarious embodiments with various modifications as are suited to theparticular use contemplated.

The Abstract is provided to comply with 37 C.F.R. Section 1.72(b)requiring an abstract that will allow the reader to ascertain the natureand gist of the technical disclosure. That is, the Abstract is providedmerely to introduce certain concepts and not to identify any key oressential features of the claimed subject matter. It is submitted withthe understanding that it will not be used to limit or interpret thescope or meaning of the claims.

The following claims are hereby incorporated into the detaileddescription, with each claim standing on its own as a separateembodiment.

Only those claims which employ the words “means for” or “steps for” areto be interpreted under 35 USC 112, sixth paragraph (pre AIA) or 35 USC112(f) post-AIA. Otherwise, no limitations from the specification are tobe read into any claims, unless those limitations are expressly includedin the claims.

What is claimed is:
 1. A heat riser apparatus, comprising: at least twostackable blocks, in which at least a portion of each is comprised of athermally conductive material; said at least two stackable blocksinclude at least an upper block and a lower block; said lower blockhaving a lower surface configured to be engaged in thermal communicationto a heat source; said lower block having an inclined upper surface;said inclined upper surface of said lower block is configured to be inthermal communication with said upper block above said lower block; saidlower block and said upper block above said lower block are elasticallycoupled with elastic components on opposing sides of said lower blockand said upper block above said lower block; said upper block above saidlower block has a complemental incline in which said upper block abovesaid lower block may slide along said lower block thereby allowing forvertical and horizontal axial elastic adjustment while providingconsistent pressure to both said heat source and a cooling source toprovide for heat dispersion along a thermal pathway; and said upperblock having an upper surface and a lower surface, wherein said uppersurface is configured to be in thermal communication with said coolingsource, and in which said elastic components are engaged at an angle,wherein angulation assists with pressure requirements in order toprovide an automatic tolerance compensation, wherein elastic limits areconfigured to be in a range of tensions that provide for securedcouplement, but do not produce excess pressure that may damage anycomponents therein.
 2. The heat riser apparatus as recited in claim 1,in which said heating source is an electronic component.
 3. The heatriser apparatus as recited in claim 1, in which said cooling sourcecomprises a cold plate.
 4. The heat riser apparatus as recited in claim1, wherein at least one of said lower block and said upper block abovesaid lower block further includes at least one internal vapor chamber.5. The heat riser apparatus as recited in claim 4, wherein at least oneinternal vapor chamber is formed within a void hollowed out from eachblock, from said at least one of said lower block and said upper blockabove said lower block, containing a vapor chamber, wherein walls ofsaid vapor chamber make up walls of each block.
 6. The heat riserapparatus as recited in claim 4, wherein at least one internal vaporchamber is a pre-sealed vapor chamber tightly inserted in to a hollowedout cavity of each block, from said at least one of said lower block andsaid upper block above said lower block, containing a vapor chamber. 7.The heat riser apparatus as recited in claim 1, wherein the at least oneof said lower block and said upper block above said lower blockincluding at least one internal vapor chamber, further includes aplurality of internal vapor chambers per block.
 8. The heat riserapparatus as recited in claim 1, in which said at least two stackableblocks consists of two blocks, wherein said upper block above said lowerblock is said upper block.
 9. The heat riser apparatus as recited inclaim 1, in which said at least two stackable blocks consists of threeblocks, wherein said upper block above said lower block is a middleblock.
 10. The heat riser apparatus as recited in claim 9, wherein saidmiddle block further includes a lower surface and an upper surface,wherein said lower surface is in thermal communication with said lowerblock and said upper surface includes a concave spherical depression forthermal communication with said upper block in which said upper blockhas a complemental convex spherical lower protrusion.
 11. The heat riserapparatus as recited in claim 1, in which the upper surface of saidlower block is a concave cylinder indention with an axial orientationparallel to the incline of said upper surface of said lower block, andsaid bottom surface of said upper block above said lower block includesa complemental convex cylindrical protrusion with an axial orientationparallel to the incline of said lower surface of said upper block abovesaid lower block.
 12. The heat riser apparatus as recited in claim 1, inwhich said elastic components are secured at distal ends of each elasticcomponent by a screw at each distal end, wherein a screw at an lowerdistal end secures said elastic component to said lower block, and ascrew at an upper distal end secures said elastic component to saidupper block above said lower block.
 13. The heat riser apparatus asrecited in claim 1, further comprising: said cooling source comprises acold plate; said heating source is an electronic component, wherein saidcomputer component includes at least one of a CPU, a GPU, and a powersupply; said at least two stackable blocks consists of two blocks,wherein said upper block above said lower block is said upper block;said lower block includes an internal vapor chamber; said upper blockincludes an internal vapor chamber; said upper surface of said lowerblock is a concave cylinder indention with an axial orientation parallelto the incline of said upper surface of said lower block, and saidbottom surface of said upper block includes a complemental convexcylindrical protrusion with an axial orientation parallel to the inclineof said lower surface of said upper block above said lower block; saidelastic components are engaged at an angle, wherein angulation assistswith pressure requirements in order to provide an automatic tolerancecompensation, wherein elastic limits are configured to be in a range oftensions that provide for secured couplement, but do not produce excesspressure that may damage any of the components therein; and said elasticcomponents are secured at distal ends of each elastic component by ascrew at each distal end, wherein a screw at an lower distal end securessaid elastic component to said lower block, and a screw at an upperdistal end secures said elastic component to said upper block.
 14. Amethod, comprising: providing a heat riser apparatus that issubstantially as recited in claim 1 applying thermal grease to surfacesof the heat riser apparatus; adjusting an angle of elastic components toachieve optimal mechanical and thermal performance; and adjusting anangle of the inclined sliding surfaces to achieve optimal mechanical andthermal performance; employing radial and spherical surfaces in betweenthe lower block and said upper block above said lower block whenmulti-axial adjustment is needed.
 15. The method as recited in claim 14,wherein providing said heat riser apparatus further comprises: providinga sliding mechanism to achieve an automatic tolerance compensationapproach, wherein said sliding mechanism comprises said incline of saidlower block and said incline of said upper block above said lower blockelastically engaging, wherein said lower block is statically engaged andsaid upper block above said lower block is dynamically slidable from useof elastic components that are engaged at an angle, wherein angulationassists with pressure requirements in order to provide an automatictolerance compensation, wherein elastic limits are configured to be in arange of tensions that provide for secured couplement, but do notproduce excess pressure that may damage any components therein;configuring said elastic components to be secured at distal ends of eachelastic component by a screw at each distal end, wherein a screw at anlower distal end secures said elastic component to said lower block, anda screw at an upper distal end secures said elastic component to saidupper block above said lower block; and slidably coupling said lowerblock to said upper block above said lower block allowing said lowerblock and said upper block above said lower block to slide formulti-axial adjustment.
 16. The method as recited in claim 14, whereinproviding said heat riser apparatus further comprises: providing atleast one of a spherical and radial surface between said lower block andsaid upper block above said lower block, wherein said at least one of aspherical and radial surface may be further defined as a concavedepression in said upper surface of said lower block, and a convexprotrusion on said lower surface of said upper block above said lowerblock, whereby said convex protrusion may slide axially along an inclineof the upper surface of the lower block along the complemental concavedepression.
 17. The method as recited in claim 14, wherein providingsaid heat riser apparatus further comprises: integrating at least onevapor chamber within said heat riser apparatus.
 18. A system for a heatriser, comprising: a heat riser apparatus, including at least twostackable blocks constructed of thermally conductive material, whereinsaid at least two stackable blocks include at least an upper block and alower block; said lower block having a lower surface configured to beengaged in thermal communication to a heat source; thermal grease onsurfaces of the heat riser apparatus; said lower block having aninclined upper surface; said inclined upper surface of said lower blockis configured to be in thermal communication with said upper block abovesaid lower block; said lower block and said upper block above said lowerblock are elastically coupled with at least two elastic components onopposing sides of said lower block and said upper block above said lowerblock; said upper block above said lower block has a complementalincline in which said upper block above said lower block may slide alongsaid lower block thereby allowing for vertical and horizontal axialelastic adjustment while providing consistent pressure to both a saidheat source and a cooling source to provide for adequate heat dispersionalong a thermal pathway, and in which said elastic components areengaged at an angle, wherein angulation assists with pressurerequirements in order to provide an automatic tolerance compensation,wherein elastic limits are configured to be in a range of tensions thatprovide for secured couplement, but do not produce excess pressure thatmay damage any components therein; said upper block having an uppersurface and a lower surface, wherein said upper surface is configured tobe in thermal communication with said cooling source; and a cold plateprovided as a cooling source, wherein said cold plate is engaged with alid component of a server.
 19. The system for a heat riser apparatus asrecited in claim 18, further comprising: said at least two stackableblocks consists of two blocks, wherein said upper block above said lowerblock is said upper block; said lower block includes an internal vaporchamber; said upper block includes an internal vapor chamber; said uppersurface of said lower block is a concave cylinder indention with anaxial orientation parallel to the incline of said upper surface of saidlower block, and said bottom surface of said upper block includes acomplemental convex cylindrical protrusion with an axial orientationparallel to the incline of said lower surface of said upper block abovesaid lower block; said elastic components are engaged at an angle,wherein angulation assists with pressure requirements in order toprovide an automatic tolerance compensation, wherein elastic limits areconfigured to be in a range of tensions that provide for securedcouplement, but do not produce excess pressure that may damage any ofthe components therein; and said elastic components are secured atdistal ends of each elastic component by a screw at each distal end,wherein a screw at an lower distal end secures said elastic component tosaid lower block, and a screw at an upper distal end secures saidelastic component to said upper block.